Multiphysics Simulation using Directly Coupled-Field Element
Technology
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Event Type:Webinar
Location: Online,UK
Date: November 15, 2007
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(Note: This broadcast is part of the NAFEMS vendor series that
allows various solutions providers the opportunity to deliver
technical information to the NAFEMS community. NAFEMS does not
endorse any vendor, but tries to provide an unbiased view of the
marketplace.)
Multiphysics Simulation using Directly Coupled-Field Element
Technology - ANSYS
As companies strive to produce innovative and higher quality
products, simulation of individual physics is no longer adequate
for the design of many products. Engineers and designers are
continuing to employ Multiphysics simulation to evaluate their
designs operating under real-world conditions.
This presentation by ANSYS, Inc. will focus on directly
coupled-field element technology. Coupled-field elements can
be used to solve many different types of Multiphysics
problems. Analysis examples include: thermal-electric
coupling, Piezoelectricity, Piezoresistivity,
thermal-electric-structural coupling, and electroelasticity to cite
a few examples. Physics coupling is accounted for by
calculating the appropriate element matrices (matrix coupling) or
element load vectors (load vector coupling) to account for the
interaction between the different physics disciplines. Many
products including; transducers, sensors, micro-electromechanical
systems, thermoelectric coolers and electronic devices require a
coupled-field simulation and can utilize coupled-field element
technology.
The presentation will also highlight a number of real-world
examples and customer applications to demonstrate the industry
application of the coupled-field element technology. Senior
development staff members from ANSYS, Inc. will also be available
to address any questions about coupled-field elements and
Multiphysics solution technology.
Coupled-Field Simulation - Wilcoxon Research
Wilcoxon Research is the world leading manufacturer of
accelerometers, shakers, and underwater acoustic sensors for
industrial and military applications. Most of our transducer
designs are piezoelectric based. To design and analyze a
piezoelectric sensor requires a coupled-field simulation. Two
examples are given in this presentation to demonstrate how we
extract the characteristics of a piezoelectric sensor by using
ANSYS Multiphysics. The simulation examples involve piezoelectric
and acoustic-structural coupled-field elements. Predicting
the performance of a sensor greatly benefits the product design and
development.
Agenda
Welcome & Introduction
- Mr. David Quinn, NAFEMS Marketing and Communications
Multiphysics Simulation using Directly Coupled-Field Element
Technology
- Mr. Stephen Scampoli , ANSYS
Coupled-Field Simulation
- Dr. Ken K. Deng, Wilcoxon Research
Q & A Session
Closing
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About the Presenters
 Stephen Scampoli
Stephen Scampoli, product manager at ANSYS, Inc., joined ANSYS in
1999. He has over fifteen years of experience in the analysis
and simulation industry, and has extensive experience in
Multiphysics modeling.
He holds a bachelor’s and a master’s degree from Tufts
University.
Elena Antonova, Ph.D.
Elena Antonova, senior development engineer at ANSYS, Inc., joined
ANSYS in 2000. She has an extensive background in the
development of coupled-field technology and Multiphysics solution
methods.
She holds a Ph.D. in Electrical Engineering from McGill University.
Ken K. Deng, Ph.D.
Ken Deng, senior development engineer at Wilcoxon Research, joined
WR in 1996. He has over nine years of experience in Multiphysics
simulation and analysis. He also has an extensive background in
product development and MEMS transducer design.
He holds a Ph.D. in Mechanical Engineering from the University of
Maryland at College Park.
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