(November 28, 2007) - Flomerics has released Version 8.1 of its
increasingly popular Engineering Fluid Dynamics (EFD) simulation
software, containing many new enhancements built on
Flomerics’ 20 years experience and research in thermal
analysis of electronics. The new functionality includes simulation
of “Joule heating”, plus new “compact”
models for IC components, heat pipes, and thermoelectric coolers.
The treatment of thermal conductivity in printed-circuit boards has
been improved and extended. The simulation of fans has also been
improved with radial and swirl components of velocity as well as
the fan performance curve now fully accounted for. Fans and heat
sources can be switched on or off at specified times, temperatures
or other specified engineering goals.
The new Joule heating model enables automatic determination of heat
sources in conducting objects as they heat up due to electric
current passing through them. The new “compact” models
use a simple two-resistor approach to represent thermal
characteristics of IC packages realistically and efficiently.
Simplified models for heat pipes and thermoelectric coolers are
also available. A new PCB generator enables automatic calculation
of the orthotropic material properties associated with complex
multi-layer printed circuit boards, and this treatment is
applicable to boards set at any arbitrary angle to the coordinate
system.
The comprehensive new library facility includes fans,
thermoelectric coolers, thermal interface materials, perforated
plates and material properties for most solid materials used in
electronic systems - including surface radiation properties.
“The combination of our existing CAD-embedded approach to
simulation coupled with the new electronics-specific functionality
and comprehensive libraries in EFD Version 8.1 delivers maximum
productivity for mechanical designers in the electronics industry
and positions us far ahead of our competitors.” said Ivo
Weinhold, Engineering Fluid Dynamics business manager at Flomerics.
A unique feature of EFD is its ability to detect fluid regions
within a CAD solid model and mesh them automatically. In Version
8.1, this powerful feature has been enhanced to detect and close
any external gaps or openings in the solid model automatically.
This saves the user time and effort by making the definition of the
fluid region even easier.
All the above functionality is available as an optional upgrade for
users of CAD-embedded versions of EFD, namely EFD.Pro for
Pro/ENGINEER, EFD.V5 for CATIAV5, and EFD.Lab for other CAD systems
including SolidWorks, Inventor and NX.
EFD 8.1 is available for immediate delivery. Interested readers
should send an email to info@flomerics.com to arrange a
demonstration or evaluation.
About Flomerics
Flomerics is a world-leading developer of engineering simulation
software and services for analysis of fluid flow, heat transfer and
electromagnetic radiation. Flomerics' business model is drastically
different from traditional analysis because its software is
designed to be embedded deeply into the design process and used by
mainstream design engineers, not just by analysis specialists.
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EFD, EFD.Lab, EFD.V5, EFD.Pro are trademarks or trade names of
Flomerics Ltd. All other products mentioned are trademarks or trade
names of their respective companies.
For further information please contact:
Mike Reynell, Director of Marketing, Flomerics Ltd
michael.reynell@flomerics.co.uk
+44 (0)208 487 3000
Date: November 28, 2007