Flomerics has announced the launch of Flopack V6.2 (www.flopack.com)
- the latest version of its web-based SmartPart library that
generates fast, accurate thermal models for IC packages and
associated parts. Thermal models created within Flopack can be
instantly imported into Flomerics’ Flotherm or FloPCB
software to analyze the cooling requirements of electronic
components, boards and systems. Key new features contained within
Flopack V6.2 include: a major expansion of the power/discrete
semiconductor package library; a new parametric rules engine that
checks for errors in design data inputs; an enhanced, more accurate
model for bond-wires; and overall improved usability.
Commenting on Flopack V6.2, Sarang Shidore, Flomerics’ Product Manager for Semiconductor Software Products said, “Providing Design Engineers with productivity gains is the driving force behind all of Flomerics’ products. Flopack V6.2 achieves this by continuing to expand its already formidable package portfolio, incorporating new design-friendly features, and by making it even easier for those people who are not usually involved with IC package design to realize substantial improvements in productivity."
For more details, please visit www.flopack.com
Further information can be obtained from: Dr. Mike Reynell, Director of Marketing, Flomerics Limited, 81 Bridge Road, Hampton Court, Surrey, KT8 9HH, UK. Tel: +44 (0)20 8487 3000.
Date: February 20, 2007