Description Qty Item Price  
your basket is empty

sub total£0.00  
£ $
proceed to checkout

Call for Papers
NAFEMS World Congress 2007

International Association Invites Papers for its 2007 Congress Event

Glasgow , UK, July 4th 2006 – NAFEMS, The International Association for the Engineering Analysis Community, has issue a Call for Papers for its 2007 World Congress, to be held in Vancouver, Canada, in May 2007.

NAFEMS is an independent not-for-profit body with the sole aim of promoting the effective use of engineering simulation methods such as finite element analysis, multibody system dynamics and computational fluid dynamics.

The NAFEMS World Congress will be the International Congress on Simulation Technology for the Engineering Analysis Community.

This conference will bring together world leading industrial practitioners, consultancies, academic researchers and software developers with a common interest in engineering analysis.

Simulation is now established in many engineering companies as part of their product development process. Whilst the conference will cover many aspects of the use of simulation, a particular focus will be how the appropriate deployment of simulation can lead to a further competitive advantage through helping to stimulate innovation.

Held at the Westin Bayshore Hotel, Vancouver, on May 22nd-25th 2007, the NAFEMS World Congress 2007 is easily accessible from across the globe.

Call for Papers

We are inviting papers from all areas of engineering simulation, including the areas listed below. If you are interested in submitting an abstract for consideration, please register your interest at  and we will get back to you with further information. 

Deadline for Abstract Submission
18th September 2006


Current Industrial Applications and Future Industrial Needs
Confidence in Engineering Analysis Results
Modelling Techniques
Integration of Analysis into the Design Process
Modelling of Materials
Failure Prediction and Assessment
Variational Studies
Computational Fluid Dynamics (CFD)
Heat Transfer
Manufacturing Processes
Multi-Body System Dynamics (MBS)
Education and Training
Software Development
Injection Moulding Simulation
Virtual Reality

Further information on all themes and topics can be found at

Visit for details on how to participate at THE International Congress on Simulation Technology for the Engineering Analysis Community.

Exhibition & Sponsorship

There are several outstanding opportunities available for your company to sponsor or exhibit at the Congress, giving you maximum exposure to a highly targeted audience of delegates, who are all directly involved in simulation, analysis and design. Further information on these opportunities can be found at


Date: July 6, 2006