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Prediction and Modelling of Failure using FEA

Call for Papers & 1st Announcement

Prediction and simulation of failure has a growing importance since designing against ultimate and fatigue strength should be predicted more precisely, as testing is expensive. Including more simulation shortens design time which often is an important parameter. A more accurate prediction of the ultimate and fatigue strength can also lead to more optimized designs.

Many materials, such as plastic and fiber composites, have a large residual strength after the material has started to yield or fail and if controlled yielding or failure growth can be allowed in extreme cases then there is a big potential to include this residual strength. Elements which allow failure growth are recently implemented in commercial FE-Software packages, which will be presented at the seminar.

The seminar will be held in Copenhagen, Denmark, which is easily accessible from most european countries. We encourage submissions from all parts of Europe.


The seminar is intended as a forum for experts in the area of prediction and modelling of failure by using FEA. The event is accompanied by an exhibition of engineering software, computer systems, and related consultancy services. A comprehensive review of the current state-of-theart and trends as well as of future challenges will thus be accessible to participants.

Contributions and topics of interest

Papers that illustrate the current state of knowledge with the help of specific applications are welcome. Furthermore, recent progress and emerging trends due to public R&D projects should be documented. Most contributions should originate from a broad industrial basis. In particular, reviews of work resulting in new knowledge obtained as well as various advanced methods of numerical simulation would be welcome.

Contributions are welcome from all industry areas, as well as from research and development showing practical applications of simulation, analysis as an engineering tool, simulation techniques and technologies.

If you have any questions regarding your presentation please contact us. After notification we will provide more information as well as pattern which you please use to create your manuscript.

For Further Information, and to register your interest, click here.