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Online Series: "Advanced Packaging: Simulation, Technology and Reliability"

Online Series: "Advanced Packaging: Simulation, Technology and Reliability"

#1 Controlling Warpage in Electronic System Integration Technologies
Speaker: Olaf Wittler

Intrinsic stresses and resulting warpage effects have a major impact on reliability during processing and the use phase of electronic components and assemblies. Fraunhofer IZM provides the full set of experience and methods in order to solve and avoid these issues. The expert session will give a brief introduction to this methodology to characterize, predict and minimize warpage effects.

Fraunhofer IZM specializes in applied and industrial contract research. With technology clusters in the field of wafer and substrate process technology as well as a high level of competence in simulation and measurement technology, the entire spectrum required for the implementation of reliable electronics and their integration into the application is covered.

Within the online workshop series "Advanced Packaging: Simulation, Technology, and Reliability" we would like to introduce Fraunhofer IZM and thematize specific technological topics. Especially, we want to show which of our latest research results and approaches you can use for your own applications/developments or as basis for joint projects.

What to expect from our Online-Sessions:
In our 45-minutes expert-sessions we would like to present to you trending topics in a technical presentation. Afterwards, our experts will be available for your questions and comments and a joint discussion.

New topics and dates for this workshop series will be published regularly on this webpage.

Information on participating / attending:
Participation is free of charge, registration is required. This workshop series aims to address our customers, partners and interested parties from industry, politics and science.


Event Type: Webinar
City: Online
Country: Online
Date: 19 Jan 2021