Electronics have increased the complexity of products. Simultaneously, the time and budget allocated to product design is shrinking, even as competition increases. Miniaturization is forcing the mechanical and electronic design flows to converge, leading to increased power densities. This makes it harder than ever to efficiently remove heat, leading to performance and reliability problems. More importantly, there are safety concerns.
How will companies adapt workflows to accommodate this growing need?
Frontloading simulation – using simulation early in the design process – helps companies develop products that are light, thin, silent and lower in cost. This can be accomplished using Simcenter Flotherm XT, a unique, award-winning thermal simulation solution that can be used during all stages of the electronics design process, from conceptual design to manufacturing, to improve product quality, reliability and time to market.
This series of four webinars offers solutions to the challenges of next-gen electronics design.
#1. Fundamentals of electronics cooling
Fundamentals of thermal engineering and the calculations that need to be performed up front
Thermal strategies to model fans and heatsinks
#2. Thermal performance of IC packages
Workflow Demo: Package Creator to generate thermal IC package models
Calibration using thermal transient test methodology from T3Ster
#3. PCB-level thermal analysis
Workflow Demo: CAD to electronics cooling solution in Simcenter Flotherm XT
Introduction to EDA bridge for accurate modelling of PCB conduction path
#4. Thermal test and validation
Workflow Demo: Use of T3ster measurements in Simcenter Flotherm XT for model calibration
Identification and quantification of thermal failure models
Register today to request access to this series of exclusive webinars. Space is limited.