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4th International Conference on Material Modeling

4th International Conference on Material Modeling


Berkeley, CA, USA

Scientific Objectives

During the past decades, material modeling has become a field of central scientific importance. Although there exist many workshops, meetings, colloquia, etc. on specific materials and particular applications, here a single conference dedicated to material modeling with all its various facets is intended. To this end, the aim of the ICMM conference is to bring together researchers from the various fields of material modeling and material characterization and to cover essentially all aspects of material modeling. This will provide the opportunity for interaction between scientists working in different subareas of material mechanics who otherwise would not come into contact with each other.

This conference is the fourth in the ICMM series. The first ICMM took place in 2009 in Dortmund, Germany; the second in 2011 in Paris, France; the third in 2013 in Warsaw, Poland.


ICMM4 will take place on the campus of the University of California, Berkeley. The historic Berkeley campus, founded in 1868, is home to a rich and diverse intellectual community. Both on- and off-campus, there is a wide range of restaurants, cafes, bookstores and other interesting venue. Berkeley is only a short metro (BART) ride from downtown San Francisco, which is a premier tourist and cultural destination. Berkeley is also easily accessible by BART from the San Francisco International airport (the main international airport of the region) and the Oakland International Airport.


Event Type: Conference
Location: Berkeley, CA USA
Date: May 27, 2015