A Surrogate Modeling Framework for Fast Thermal–Mechanical Reliability Analysis of Discrete Power Packages

F​ree Webinar

Wednesday, 18 March 2026 | Online

14:00 (Bengaluru)
09:30 (Berlin) | 08:30 (London)

P​art of the प्रवाह -Pravaha - NAFEMS India Webinar Series
E​xploring Frontiers in Engineering Modelling & Simulation

The thermal performance and reliability of discrete power electronic packages are increasingly constrained by miniaturization and high power density. Thermo-mechanical fatigue of solder joints, driven by repetitive thermal cycling during power switching, remains a primary failure mechanism. While finite element modeling (FEM) provides accurate lifetime predictions, its high computational cost limits its applicability during early design stages.

This work presents a surrogate modeling framework for rapid thermal–mechanical assessment of discrete packages in the conceptual design phase. A finite element–based virtual design of experiments (VDoE) is used to evaluate the influence of key parameters, including thermal interface material thickness, chip area, mold compound properties, and PCB layout. Sensitivity analysis identifies dominant contributors to thermal resistance and fatigue life, and surrogate models are developed using response surface and regression techniques.

The approach is demonstrated on a DC–DC converter package mounted on a rectifier PCB, enabling efficient design optimization with significantly reduced computational effort. The framework supports future extension toward digital twins and data-driven reliability prediction.

Agenda

• W​elcome & Introductions
  J​o Potts, NAFEMS
• U​pdate on NAFEMS India
  NAFEMS India Chair - Uma Maheshwar | BEC - GE Aerospace
  NAFEMS India Chair Elect - Jaya Raju Namala | Airbus Group India Private Ltd. 
• A Surrogate Modeling Framework for Fast Thermal–Mechanical Reliability Analysis of Discrete Power Packages
  Mr. Naveen Srinivasappa, Bosch India

• Q​&A

O​ur Speaker

Naveen Srinivasappa, Tech Lead BGSW India

Masters in Engineering from Indian Institute of Science, Bangalore

As a Tech Lead at Bosch in India with over 13 years in CAE, I specialize in the thermo-mechanical reliability of Electronic Control Units. My team's work is centered on 'Design for Reliability,' where we analyze potential failure modes to develop durable designs. Our technical expertise covers solder fatigue, material plasticity and creep, virtual design of experiments, and applying AI and ML to advance our simulation methodologies.

External publications:

1. ‘Reliability testing in molded packages by warpage measurements’  -  Naveen Srinivasappa.iCAIM 2014, International Conference on Applications for Image based Measurements, June 24-25, 2014, Leipzig, Germany
2. ‘Simulation to predict failure within the electronics power module for different testing condition’-  Naveen Srinivasappa. ANSYS Electronics Simulation Expo conference, 31st August 2017, Bangalore, India.
3. ‘Genetic algorithm-based optimization of Chaboche kinematic hardening parameters along with the validation of FE model through characterized crack initiation”, - Parichay Basu, Naveen Srinivasappa SAE ADDMS, 7th Feb 2026, Salem, India.