This conference paper was submitted for presentation at the NAFEMS World Congress 2025, held in Salzburg, Austria from May 19–22, 2025.
Abstract
The Mini Modular Racking Principle (MiniMRP) constitutes a family of modular PCB enclosures tailored for avionic systems. Various MiniMRP variants are subjected to diverse terrain loading scenarios, encompassing dynamic, thermal shock, and drop tests. The aluminum enclosures of MiniMRP have been replaced with composite alternatives, necessitating compliance with designated standards. Conducting physical tests on specimens is time-intensive, leaving no room for redesign iterations post-physical testing. Designers aspire to swiftly predict assembly performance to facilitate quick design modifications prior to advancing to the physical test process. Component is made of short fiber composite material including E glass as reinforced material and PEI as matrix material. Fiber orientation mapping and its mesh mapping in CAE geometry is difficult task. Hence, Mold flow simulation is carried out to map the fiber and mapped files is imported to structural simulation. Material properties is calibrated as per fiber aspect ratio and applied. Simulation has been systematically conducted for all sets of physical test plans, identifying potential design failure risks and offering recommendations to meet design requirements. To verify dynamic structural strength, modal, random vibration, and harmonic analyses were carried out. Transient thermal analysis was employed to forecast component thermal behavior, while static structural analysis addressed torque loading and bolt pretension loading. Simulation was employed comprehensively to evaluate the structural integrity of the assembly.
Reference | NWC25-0007037-Paper |
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Author | Govindaraju. M |
Language | English |
Audience | Analyst |
Type | Paper |
Date | 19th May 2025 |
Organisation | TE Connectivity |
Region | Global |
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