This conference paper was submitted for presentation at the NAFEMS World Congress 2025, held in Salzburg, Austria from May 19–22, 2025.

Abstract

The growing complexity of Ball Grid Array (BGA) packages, driven by advancements in AI and high-performance computing, has introduced significant mechanical challenges in electronic packaging. Larger chips and higher pin counts amplify stress concentrations and deformation risks, making solder joint reliability a critical factor in ensuring package performance and durability. Solder reflow simulation, an emerging technique, provides essential insights into solder joint behavior, enabling engineers to predict solder joint shapes, assess potential defects, and optimize designs. Traditionally, the analysis of solder reflow in large BGAs was not included in simulation workflows due to the lack of commercial tools capable of addressing this challenge. The introduction of the ISPG method in Ansys LS-Dyna marked a breakthrough, enabling accurate simulation of the solder reflow process. However, setting up such simulations for large-scale models remains a significant challenge. The process of defining geometry, creating meshes, and applying boundary conditions demands extensive manual effort, often taking hours for models with thousands of solder joints. This labor-intensive setup slows iterative design cycles, delaying the identification and mitigation of reliability risks. This work presents an innovative approach to addressing the challenges of large-scale solder reflow simulation. By automating the setup process through advanced scripting tools, our workflow reduces input generation time to under 10 minutes, even for models exceeding 4,000 solder joints. The workflow incorporates key steps such as geometry creation, meshing, boundary condition application, and parameter configuration with minimal user intervention. Post-processing tools further enhance efficiency by providing detailed metrics, including solder joint height, diameter, and defect-prone regions based on predefined failure criteria. This automated methodology empowers engineers to rapidly iterate on BGA designs, delivering actionable insights early in the development cycle. By reducing reliance on manual setup processes, it enables faster, more accurate evaluations of solder joint reliability. These advancements not only enhance design efficiency but also support the development of robust, reliable packages for next-generation electronic systems. By offering a scalable and effective solution for solder reflow simulation, this workflow bridges the gap between the growing demands of complex electronic packaging and the need for efficient predictive modeling techniques. This innovation establishes a foundation for advancing reliability analysis in cutting-edge electronics manufacturing.