Ansys to acquire Diakopto, expanding it multiphysics simulation portfolio

A provider of EDA solutions to accelerate integrated circuit (IC) development, Diakopto focuses on helping resolve critical issues caused by layout parasitics.

The transaction is expected to close in the second quarter of 2023 and is not expected to have a material impact on Ansys' consolidated financial statements in 2023.

Semiconductor designs increasingly employ advanced process node technologies, where interconnect parasitic effects limit the performance, reliability, and functionality of designs. Diakopto’s products are used by dozens of customers, including tier-one semiconductor companies, for a broad range of applications.

With the acquisition, Ansys will better enable design engineers to “shift left,” and to detect interconnect parasitic problems early in the design cycle. Diakopto’s products provide actionable analytics to guide designers to fix these problems – a capability that has not existed before. Through early identification and what-if analysis of parasitic problems, engineers will be able to minimise costly iterations late in the design cycle – furthering cost and time savings.

“Diakopto’s culture of strong engineering excellence and its innovative and highly differentiated products create a natural alignment with our organisation,” said Shane Emswiler, senior vice president of products at Ansys. “Incorporating Diakopto’s unique methodology will support designers using Ansys to quickly and easily pinpoint the few elements, out of billions, causing bottlenecks. Designers can then optimise and debug designs more efficiently for enhanced IC performance and reliability and accelerate time to market.

“The acquisition will complement Ansys’ existing offerings for engineers at every level as Diakopto’s intuitive and out-of-the-box experience doesn’t require extensive training or complicated setups or configurations.”

Commenting Maxim Ershov, CEO and CTO at Diakopto, said, “By joining forces with Ansys, we’re confident that we can solve a broader set of problems in the chip design workflow together, strengthening offerings for our customers and driving more innovations in high-tech designs for data centre, 5G, automotive, and mobile applications.”

www.ansys.com