NAFEMS Webinar Series
Multiphysics Simulation using Directly Coupled-Field Element Technology
View this webinar (PDF) - (Members Only)
(Note: This broadcast is part of the NAFEMS vendor series that allows various solutions providers the opportunity to deliver technical information to the NAFEMS community. NAFEMS does not endorse any vendor, but tries to provide an unbiased view of the marketplace.)
Multiphysics Simulation using Directly Coupled-Field Element Technology - ANSYS
As companies strive to produce innovative and higher quality products, simulation of individual physics is no longer adequate for the design of many products. Engineers and designers are continuing to employ Multiphysics simulation to evaluate their designs operating under real-world conditions.
This presentation by ANSYS, Inc. will focus on directly coupled-field element technology. Coupled-field elements can be used to solve many different types of Multiphysics problems. Analysis examples include: thermal-electric coupling, Piezoelectricity, Piezoresistivity, thermal-electric-structural coupling, and electroelasticity to cite a few examples. Physics coupling is accounted for by calculating the appropriate element matrices (matrix coupling) or element load vectors (load vector coupling) to account for the interaction between the different physics disciplines. Many products including; transducers, sensors, micro-electromechanical systems, thermoelectric coolers and electronic devices require a coupled-field simulation and can utilize coupled-field element technology.
The presentation will also highlight a number of real-world examples and customer applications to demonstrate the industry application of the coupled-field element technology. Senior development staff members from ANSYS, Inc. will also be available to address any questions about coupled-field elements and Multiphysics solution technology.
Coupled-Field Simulation - Wilcoxon Research
Wilcoxon Research is the world leading manufacturer of accelerometers, shakers, and underwater acoustic sensors for industrial and military applications. Most of our transducer designs are piezoelectric based. To design and analyze a piezoelectric sensor requires a coupled-field simulation. Two examples are given in this presentation to demonstrate how we extract the characteristics of a piezoelectric sensor by using ANSYS Multiphysics. The simulation examples involve piezoelectric and acoustic-structural coupled-field elements. Predicting the performance of a sensor greatly benefits the product design and development.
Welcome & Introduction - Mr. Matthew Ladzinski, NAFEMS North American Representative
Multiphysics Simulation using Directly Coupled-Field Element Technology - Mr. Stephen Scampoli , ANSYS
Coupled-Field Simulation - Dr. Ken K. Deng, Wilcoxon Research
Q & A Session
Event Type: webinar
Location: online USA
Date: October 18, 2007
About the Presenters
Stephen Scampoli, product manager at ANSYS, Inc., joined ANSYS in 1999. He has over fifteen years of experience in the analysis and simulation industry, and has extensive experience in Multiphysics modeling.
He holds a bachelor’s and a master’s degree from Tufts University.
Elena Antonova, senior development engineer at ANSYS, Inc., joined ANSYS in 2000. She has an extensive background in the development of coupled-field technology and Multiphysics solution methods.
She holds a Ph.D. in Electrical Engineering from McGill University.
Ken Deng, senior development engineer at
Wilcoxon Research, joined WR in 1996. He has over nine years of experience in Multiphysics simulation and analysis. He also has an extensive background in product development and MEMS transducer design.
He holds a Ph.D. in Mechanical Engineering from the University of Maryland at College Park.