These slides were presented at the NAFEMS World Congress 2025, held in Salzburg, Austria from May 19–22, 2025.

Abstract

Thermal management plays a critical role in electronics, particularly within Grundfos, where reliable and efficient systems are essential to our product offerings. To address thermal management challenges effectively, simulations are widely recognized as a powerful tool. This paper introduces a comprehensive engineering tool developed by Grundfos that automates and democratizes high fidelity thermal simulations for PCB designers and engineers. The Thermal PCB tool is a web-based solution designed to perform automated thermal simulations of printed circuit boards (PCBs) and advanced thermal component models. Based on the latest trends within web-based user frameworks for app creation and Python packages that enables the usage of simulation software through Python, this tool enables investigations into the thermal performance of electronics and assemblies. Users can easily import the layout PCB file, along with a related power budget containing relevant power budget. With the ability to customize the surrounding thermal conditions, users can build a simplified models using an automated interface. This tool leverages both actual PCB designs and a vast library of complex 3D thermal models, encompassing passive and active components, as well as Power Modules. The thermal models are carefully validated through tests, ensuring a high degree of accuracy in the simulation results. By providing engineers and PCB designers with access to pre-built thermal models, the tool eliminates the need for extensive expertise in simulation software. As a result, a wider range of individuals within the organization can employ thermal simulations without relying solely on simulation experts, thus democratizing the use of this valuable technology. One of the primary benefits of the Thermal PCB tool is its utility in verifying and validating new designs. By generating accurate thermal analysis, it reduces the dependency on physical tests. This not only saves valuable time and resources but also lowers research and development costs. Additionally, the tool accelerates the product development cycle, enabling faster time-to-market for Grundfos. By obtaining critical thermal insights at an early stage, engineers can make informed design decisions, leading to improved product quality. In conclusion, the Thermal PCB tool represents a significant advancement in engineering capabilities by automating and democratizing high fidelity thermal simulations of electronics. By providing PCB designers and engineers with an accessible platform for performing thermal simulations and validating performance, Grundfos enhances product development efficiency, reduces costs, and improves product quality. This tool epitomizes Grundfos' commitment to innovation and technological excellence in the field of thermal management.