NAFEMS Using Collaborative Simulation Process to Accelerate the Thermally Aware Chip-Package Design

This Website is not fully compatible with Internet Explorer.
For a more complete and secure browsing experience please consider using Microsoft Edge, Firefox, or Chrome

Using Collaborative Simulation Process to Accelerate the Thermally Aware Chip-Package Design

This presentation was made at the European Conference: Simulation Process and Data Management (SDM).

Document Details

Reference	C_Nov_10_SDM_25
Authors	Lehnhäuser. T Karimanal. K Bhide. S
Language	English
Type	Presentation
Date	25th November 2010
Organisation	ANSYS

Download

NAFEMS Member Download

Back to Previous Page

Using Collaborative Simulation Process to Accelerate the Thermally Aware Chip-Package Design

Document Details

Download

NAFEMS Membership

ISO accredited