Using Collaborative Simulation Process to Accelerate the Thermally Aware Chip-Package Design

This presentation was made at the European Conference: Simulation Process and Data Management (SDM).

Document Details

ReferenceC_Nov_10_SDM_25
AuthorsLehnhäuser. T Karimanal. K Bhide. S
LanguageEnglish
TypePresentation
Date 25th November 2010
OrganisationANSYS

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